Agilent 5DX Series 3 X-Ray Inspection

Agilent 5DX Series 3 ID: 6158

Agilent 5DX Series 3 {ID: 6158}

Industry-Leading Technology for Catching Defects and Improving Processes
CEE ID: 6158
Status: Available
Model: 5DX Series 3
Vendor: Agilent
DOM: 2000
Condition: Superior to inline with its age
Cycles: 9/22/00
Facilities: 200-240VAC 1ph or 3ph
Dims: 75" x 58" @ 7500 lbs

PM'd by KeySight - 9/6/16
The Agilent 5DX
The Agilent 5DX makes sense in an age where boards, budgets and timelines continue to shrink. It accelerates programming with step-by-step tools and a point-and-click graphical user interface. It finds hidden defects on advanced PCBA packages such as BGAs, CSPs, CCGAs, press fit connectors and more.  It keeps AXI simple, effective and cost-effective, and solves everyday challenges on the test floor.
Agilent 5DX Series 3
The Agilent 5DX Series 3 outperforms other test technologies for testing complex PCBAs. It's faster and more repeatable than manual X-ray or manual visual inspection. It's more accurate and provides greater coverage than 2D X-ray and AOI. It overcomes electrical access limitations and provides much higher defect coverage than in-circuit test, and does it with simpler programming and without the time or cost of fixture development. The 5DX is a good fit for manufacturing environments that need to ramp-up fast and keep complex, fully tested boards moving down the line and out the door. It's especially well suited to high-end telecom (routers, switches and servers including active backplanes), high-end servers, datacom, medical products, military, aerospace, and other industries with complex board designs. The Agilent 5DX Series 3 is available for board sizes of up to 18 x 24 inches, and larger heavier boards up to 24 x 40 inches.
Industry-Leading Technology for Catching Defects and Improving Processes
The Best Test, Period
The Agilent 5DX is more effective at finding manufacturing defects on printed circuit board assemblies (PCBAs) than any other test solution on the market today.  By itself, this automated X-ray test system catches over 97 percent of all solder related defects (such as opens, shorts, voids, and insufficient or excess solder) and over 90 percent of all manufacturing defects on PCBAs. Combined with other test solutions such as automated optical inspection (AOI), in-circuit test (ICT) and functional test, the Agilent 5DX provides virtually failsafe defect coverage on today's complex boards. And it provides that coverage fast, scanning both sides of a double-sided PCBA with one pass, inspecting thousands of solder joints per minute.
Total solder joint coverage
X-ray test is the only technology capable of inspecting BGA, CCGA, CSP, and other area array solder joints.  With its patented 3D technology, the Agilent 5DX is able to zero-in on specific layers of a PCBA to inspect surface features with extreme accuracy. It literally sees through obstructions such as BGA packages, RF shields and component packages to inspect hidden solder joints on both sides of a PCBA. Of course, it also inspects traditional SMT and through-hole components such as QFPs, SSOPs, connectors, and chip components. The result is a fast, repeatable test that catches more defects earlier in the assembly process, and provides actionable information for faster repairs.
Automatic analysis, actionable information
The Agilent 5DX doesn't just capture X-ray images. It transforms images into useful, “actionable” information. The Agilent 5DX uses a suite of patented algorithms to isolate open solder joints, solder bridges, misaligned and missing components, insufficient and excess solder, and solder voids. The defect data, including component, pin number, defect type, and X-ray image, are then reported to the Agilent Repair Tool (ART) for easy, effective repair.
Simple programming
The Agilent 5DX includes a suite of tools to simplify most day-to-day development tasks in X-ray test. CAD files are translated automatically. Program thresholds are tuned by the system to increase call accuracy. A program advisor checks your tests and provides recommendations to improve accuracy and fault coverage.  Defect coverage reports tell you the coverage you're getting and indicate where coverage can be improved.  This kind of built-in intelligence allows you to get the full value out of your Agilent 5DX and take advantage of its inherent power. Most test professionals can begin working productively with the system in one day, even if they have no prior experience with X-ray test.
Provable ROI
Every board defect has a cost, either in time, money, or product quality. The Agilent 5DX keeps those costs to a minimum. It catches defects early so you get a higher yield of good boards moving down the line. The results can be dramatic. Fewer boards to repair. Fewer bottlenecks at ICT and functional test. Less scrap. Less repair time. Lower warranty costs. Higher end-product quality.  And, ultimately, happier customers. Those are some of the reasons why the Agilent 5DX is used by hundreds of electronics manufacturers worldwide, including the world's ten largest OEMs and 20 largest contract electronics manufacturers (CEMs).  
Agilent 5DX Series 3 Model Specifications
Model 5400
Description   Ultra Fine Pitch
Field of View   From 5. to (0.2 to 0.8 in.)
Joint Pitch   0.2 mm & up (0.008 in. & up)
Top Clearance   9.4 to (0.37 to1.0 in.)
Bottom Clearance   30 mm (1.2 in.)
Performance Specifications
Test Speed (joint/sec)
The exact speed depends on the density of the component layout on the circuit board. Generally speaking, the more dense the circuit board, the higher the test speed. The typical range in test speeds is from 80 to 140 joints/second (including inspection, alignment, surface map, and board handling time).
Image Acquisition Time (including movement)
Up to 5 images per second
Load/Unload Time
12 seconds per panel for pass-through mode, 15 seconds for pass-back mode, 6 seconds per panel using dual loading
Alignment Time
3 to 8 seconds (depending on board size)
Surface Map Time (Points/Second)
Up to 5 points/sec (typical map density is 1 point / 645–2580 sq. mm (1–4 sq. inches)
Board Specifications / Tolerances
Board Handling Size (width x length)
Max.: 457 x 609 mm* (18.0 x 24.0 inches)
Min.: 102 x 127 mm† (4.0 x 5.0 inches)
Aspect Ratio: Board length > = 0.5 x board width
Maximum Test Area A
Standard (width x length)   356 x 597 mm (14.0 x 23.5 in.)
With expanded test area option (width x length)   445 x 597 mm (17.5 x 23.5 in.)
Board thickness A
Max.: 3.2 mm (0.125 in.)
Min.: 0.5 mm (0.020 in.)
Board Width Tolerance
± 0.7 mm (0.0275 in.)
Board Edge Clearance
3 mm (0.118 in.) on parallel edges of the board (top and bottom side clearance requirement)
Board Warpage (after reflow and wave soldering)
Normal board usage requires a warpage of less than 1% of any linear dimension (0.01 inch/inch or 0.01 mm/mm), assuming that the overall board dimensions still fit within the board clearance and width specifications. Maximum board warpage cannot exceed 2 mm (0.08 in.).  Board warpage of 0.5% or less is required to maximize throughput for some device types.
Maximum Acceptable Board Weight
(including board carrier)
4.5 Kg (10 lb.)
1 Kg (2.2 lb.) per panel with dual load option
Minimum Acceptable Board Weight
0.03 Kg (.066 lb.)
Maximum Acceptable Board Temperatures (at time of load)
40°C (104°F)
Defects Detected
The algorithms identify the following types of defects:
• Shorts
• Opens
• Misalignment
• Insufficient solder
• Missing Component
• Solderball
• Excess solder
Minimum Feature Detection
Short Width (at 5 mm [0.2 in.] FOV) System:   0.035 mm (0.0014 in.)
Solder Height:   0.0127 mm (0.0005 in.)
This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional for your live or video acceptance. If you require special acceptance criteria, please discuss this with your CEE sales agent. Availability is subject to prior sale.


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.




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